IBM's Strategic Patterning Research group at Albany Nanotech is currently seeking engineers in the area of plasma etch for advanced patterning, including multiple patterning, EUV, and DSA. The hired candidates will have significant expertise in the area of reactive ion etch or a similar field. Some of the job responsibilities include the development of advanced patterning sequences and analysis of patterning performance. The candidates must understand the fundamental principles of reactive ion etch processes, and will define the path for leading patterning methodologies from concept through implementation. The positions require interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development, process integration, design/layout, materials and process development, and computational technology. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. The hired candidates must possess strong analytical and design-of-experiment knowledge, excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.
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