IBM is hiring a Lead InterConnect Engineer to design, develop and document interconnect packaging for power, thermal and electronic components in high end computer systems from concept through market introduction, including ongoing product engineering and design support for production and field systems.
Specific responsibilities include lead technical architecture for interconnect defining connectors, cables, and other means of designing electrical components into compute, server, storage or similar devices , performing high level system interconnect design and architecture, performing early characterization and full functional testing and application verification for prototypes, participating in technical supplier selection and business awards, performing long term qualification testing for all components and system level quality as well as failure analysis and quality management.
Successful candidate will lead design teams and work primarily with a cross-functional team across system hardware development. This will include thermal, power, card and board design, processor and module level design, memory, interconnect, I/O, storage, Manufacturing, Service, Reliability, Availability, Serviceability, various compliance teams including shock and vibration, EMC, and acoustics. In addition, the person would interface with procurement, suppliers, supplier management and supplier quality teams as well as various executive management and program management contacts.
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IBM is the world’s largest information technology company with more than 360,000 employees serving clients in 170 countries.