IBM is currently looking for a Model Integration & Release Engineering Professional for their Albany, NY office.
The Model Integration & Release Engineering Professional will develop software infrastructure for building and testing semiconductor technology compact device models. This role will also include the verification, integration and packaging of compact models as part of the overall technology PDK (process design kit) deliverable.
Qualified applicants will have an Associate's Degree, Bachelor's Degree or College Diploma, at least 1 year experience developing automation and scripting using languages such as Perl, TCL, and/or C, a basic understanding of Field-Effect Semiconductor (FET) devices, and be fluent in English (both verbal and written) and strong communication skills.
Applicants with a Master's Degree in Electrical Engineering, Computer Science or a related field, at least 3 years experience in Apply Knowledge of Semiconductor Technology, at least 3 years in Computer Engineering, basic knowledge of circuit simulators (HSpice, Spectre, PowerSpice) and Verilog-A, a basic knowledge of BSIMCMG/BSIMIMG are preferred.
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IBM is the world’s largest information technology company with more than 360,000 employees serving clients in 170 countries.